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Prevention Device Product List

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MEGCON

Control the specific resistance of ultrapure water to solve electrostatic interference in precision cleaning.

Standard precision cleaning is performed using ultra-pure water with almost no ionic components, which can lead to product defects due to static electricity, such as: - Circuit destruction (static breakdown) - Surface charging of the cleaned objects and re-adhesion of fine particles ⇒ MEGCON suppresses static electricity generation by dissolving carbon dioxide in ultra-pure water through a membrane, creating functional water with adjusted resistivity. Based on approximately 7,000 sales records, it contributes to reducing your company's product defects (improving yield). ■ Features Automatic and abundant control methods - Automatic batch resistance control during flow rate fluctuations allows connection to multiple die and cleaning machines. - Three types of control methods can be selected based on distance. Efficient gas supply - Gas consumption is minimized with gas quantity control according to flow rate. (Under conditions of 0.5 MΩ·cm and 9 L/min, gas consumption is 1.62 grams/hour.) - Capable of gas supply in a central system - Gas dissolution through a membrane minimizes the risk of fine particle contamination Rich lineup - Available in large flow type (up to 8,000 L/h) and small flow type (from 30 L/h) - CE marking series available for export to Europe

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Ultra-pure water anti-static device MEGCON PRC2+ Rack type

Automatically control the specific resistance of ultrapure water to solve static electricity issues in precision cleaning.

Regular precision cleaning involves washing with ultra-pure water that contains almost no ionic components, which can lead to product defects due to electrostatic interference, such as: - Circuit destruction (i.e., electrostatic destruction) - Surface charging of the cleaned items and re-adhesion of fine particles ⇒ MEGCON suppresses the generation of static electricity by dissolving carbon dioxide in ultra-pure water through a membrane, creating functional water with adjusted resistivity. Based on approximately 7,000 sales records, it contributes to reducing your company's product defects (improving yield). ■ Features Automatic and abundant control methods - Automatic batch resistance control during flow rate fluctuations allows connection to multiple die and cleaning machines. - Three types of control methods can be selected based on distance. Efficient gas supply - Gas consumption is minimized through gas quantity control according to flow rate. (Under conditions of 0.5 MΩ·cm, 9 L/min, gas consumption is 1.62 grams/hour.) - Capable of gas supply using a central system. - Gas dissolution through membrane methods minimizes the risk of fine particle contamination. Extensive lineup - Offers large flow types (up to 8,000 L/h) and small flow types (from 30 L/h). - Includes CE-marked series that can be exported to Europe.

  • Other semiconductor manufacturing equipment

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